Photolithography & MEMs Fabrication
Photolithography & MEMs Fabrication
VIEW metrology solutions measure critical dimensions in a wide variety of applications involving 2D micro-components and assemblies. Compared to “walk up and measure” routines, VIEW systems are designed for continuous operation in automated production environments, with speeds that often help metrology teams achieve 100% inspection.
Metrology in semiconductor and MEMS fabrication
MEASURE ORIFICE DIAMETER AND POSITION WITH SUB-MICRON ACCURACY
Measurement of orifice diameters.
Relative alignment of top/bottom orifices.
Orifice diameter/position measurement accuracy of < 10 nm.
As today’s semiconductor designs continually become smaller and denser, the challenges of wafer inspection are constantly escalating. Extremely small feature sizes can require 50X or higher objective lens magnification and highly programmable top-lighting/back-lighting, along with ultrahigh-resolution accuracy and repeatability.
Metrology system used: PRECIS
ENSURE PRECISION MOTION AND MOTION DETECTION
Measure a wide variety of critical dimensions on MEMS devices, including pitch, width, and spacing of flexures, fingers, combs, arcs, circle diameters, and center locations. Because of the myriad of requirements for MEMS devices, they can range from a few microns in size to a few millimeters.
The key aspect of MEMS devices is that they incorporate moving components. A MEMS device must either cause one of its components to move, or allow a component to move based on external influence, and then sense that motion.
The moving component of a MEMS device typically employs a flexure, and detection of the motion often involves sets of interleaved “fingers” or “combs.” For precise motion and motion detection, knowing the dimensions of the flexures and motion detection components is critical.
MEASURE GATE PLATE DIAMETERS AS SMALL AS A MICRON
Manufacturing Field Emitter Displays (FEDs) and ensuring the precision and quality of their fabricated components presents a daunting challenge. One such challenge involves precisely measuring hole diameters and roundness in a FED gate plate with accuracy of ± 0.01 µm or better.
Manufacturing Field Emitter Displays (FEDs) and ensuring the precision and quality of their fabricated components presents a daunting challenge. One such challenge involves precisely measuring hole diameters and roundness in a FED gate plate with accuracy of ± 0.01 µm or better.
The small features, fragile connections, and critical three-dimensionality of wire bonded assemblies require high-performance, non-contact metrology solutions. Functions such as multiple magnification, creative lighting, and advanced image processing are needed in order to measure critical features such as ball and tooling mark diameters, placement and pad alignment, and wire loop height.
