Mobile Phone – Tablet – Wearable Assembly
Mobile Phone, Tablet & Wearable Assembly
VIEW metrology solutions measure critical dimensions in a wide variety of applications involving 2D micro-components and assemblies. Compared to “walk up and measure” routines, VIEW systems are designed for continuous operation in automated production environments, with speeds that often help metrology teams achieve 100% inspection.
Measurement in semiconductor packaging
Flip chip processes present a number of critical metrology challenges including the need for precise three-dimensional measurements to accurately inspect pad size, position, and distance from the package edges as well as confirming acceptable flatness and coplanarity.
Accurate and efficient non-contact inspection of flip chips often requires advanced features such as multiple levels of magnification, Programmable Ring Light (PRL), and integrated lasers to improve inspection throughput rates.
Flex circuit technologies pose a wide range of metrology challenges with a large number of different circuit geometries, pitch dimensions, and surface reflectivity factors.
To meet these challenges, metrology systems for flex circuit inspection must incorporate advanced functionality such as versatile lighting, large-size stages, high-resolution positioning, and very accurate laser probe capabilities
Quad Flat Pack (QFP) and Ball Grid Array (BGA) components represent metrology challenges with very tight tolerances that can tax the capabilities of even high performance systems.
Coplanarity, lead width, pitch, ball diameter, package height and warpage, and the need to inspect for damaged or missing balls/leads can all be critical factors. In addition to the needs for versatile lighting and high-performance image processing, effective QFP/BGA inspection also requires integrated laser capabilities for rapid and accurate Z-axis measurements.
