Electronic Assembly Calibration & Monitoring
Electronic Assembly Calibration & Monitoring
VIEW metrology solutions measure critical dimensions in a wide variety of applications involving 2D micro-components and assemblies. Compared to “walk up and measure” routines, VIEW systems are designed for continuous operation in automated production environments, with speeds that often help metrology teams achieve 100% inspection.
Measurement in electronic assembly supervision
Metrology solutions for fiber optic interconnect components (“ferrules”) require high accuracy and throughput. One of the critical dimensions is the concentricity of the outer housing to the fiber optic center. This ensures proper interface to support high-speed communications infrastructures.
A typical requirement for concentricity is less than a micron. To achieve this level of accuracy, staging of the ferrule normal to the optical axis is critical. Although a plane could be established by acquisition of points from the surface of the ferrule, the accuracy of the data points for the OD and ID should be taken without stage motion within a single FOV. This is accomplished with the 6:1 digital zoom capability of VMS.
The inspection of connectors requires metrology solutions that can provide high accuracy over relatively large travel areas with consistent repeatability. Key features in motherboard connector inspection include measuring the true position and pitch of each lead within large multi-lead arrays.
In addition, metrology platforms for inspecting connectors must also include advanced lighting and programming capabilities to quickly and accurately acquire complex connector features.
The effective inspection of PCB connectors requires metrology solutions that can accurately measure a wide variety of connector dimensions while providing the fast cycle times and throughput required for high-volume near in-line production-oriented processes. Efficient and highly repeatable measurement capabilities are needed to quickly acquire data on lead (male) and slot (female) connector positions along with size, pitch, and coplanarity measurements.
Flexible advanced programming options and large stage sizes are needed to handle a wide variety of feature shapes and sizes. For surface mount technology (SMT) connectors, laser options may be required to provide faster cycle times for Z-axis measurements of coplanarity.
Component placement verification in electronic assemblies presents metrology challenges that are almost as wide and varied as the range of electronic designs and the types of components used. Key process control parameters that must be measured include component positioning and rotation (X, Y, and theta) relative to pads, as well as checking for missing and/or damaged components.
These basic requirements are further complicated by the very wide variety of component sizes, shapes, colors, etc., which necessitates highly versatile lighting options, robust image processing capabilities, and a high degree of system programmability and flexibility. In some implementations, metrology systems may also require the adaptability to be integrated directly with pick-and-place equipment as a unified processing and inspection cell.
